Mobility and Wearables WLCSP Solutions

MiND.X (AI) Enabled Die Sorter
MiND.X (AI) Enabled Die Sorter

MiND.X (AI) Enabled Die Sorter

Mi Quantum and Quantum Plus

  • Most Advanced AI and Industrial 4.0 Driven Platform!
  • Market Leading UPH > 50K UPH!
  • MiND.X enabled Vision Platform - Reduce Overkill & Underkill!
  • 9S AOI – 6S Optical + Sidewall IR, Backside IR and Latest Laser Groove IR AOI (available in Quantum Plus Platform)!
  • Most Flexible platform - with Dual Track, De-taper options
  • Big Die Size Platform, up to 16x16mm and 35x35mm, both available!
  • Industrial 4.0 Automation Available with Auto Cassette and Auto Reel Change Platform - One of its Kind!
  • Fast Conversion, Poka-yoke and Self Diagnostics Health Check Platform!
Reel to Reel IR Inspection

Reel to Reel IR Inspection

Vi Series

  • Reel to Reel IR inspection
  • High UPH
  • MiND.X upgradeable to extend inspection capability!
  • Most reliable QC and RMA platform
  • Optical Inspection included to complete multi-faceted inspections