Where We Are

Equipment Malaysia"s history can be traced back to 2007 with the founding of DPE Integration (M) Sdn Bhd, which ventured into the R&D of die processing equipment. In June 2012, Mi Equipment Malaysia was incorporated in Penang, focusing on the R&D and manufacturing of advanced packaging die sorting machine while DPE slowly phased out. Since then, Mi Equipment Malaysia has grown rapidly. We continue to lead in technology breakthroughs through the years of rigorous technology development together with our teams of highly professional and passionate engineers while partnering closely with our semiconductor clients.

Mi Equipment Malaysia, serves as the headquarter of Semiconductor Equipment Business Unit, is strategically located in Bayan Lepas, within the heart of Penang semiconductor industrial area.

Our five-storey state-of-the-art building was completed in May 2019. With a total floor space of approximately 200k sq ft, it houses Mi Equipment Malaysia's operations and R&D center which focus on Mi series and Vi series solutions.

Mi Equipment China incorporated in January 2013, serves as a major regional sales & service support center supporting Mi Equipment solutions for our customer base in the fast-expanding semiconductor industry in China.

In response to the growing market, Mi Equipment China engineering center was established in 2020, based in Suzhou. In 2021, Mi Equipment China has expanded its business scope to cover manufacturing activities which focus on Si series - fine pitch test handlers for 5G, MEMS, high power devices, KGD ("Known Good Dies"); both at wafer and final package levels.

The factory in Suzhou City was newly renovated in 2021 and has a total floor space of approximately 45k sq ft. It is complemented by a fast-growing engineering team for Si series development and manufacturing.